Adopting non-contact laser vaporization cutting without mechanical stress, it will not cause physical damage to fragile components such as flexible printed circuits (FPC) and 0201 packaged micro-components, greatly improving product yield.

The heat-affected zone is only about 0.1mm. The cutting edge is smooth without burrs and delamination. Workpieces can directly proceed to the next welding process without extra grinding, effectively saving process costs.

It is capable of cutting various materials including FR4 rigid boards, FPC flexible boards, rigid-flex boards, SiC power modules and ultra-thin substrates, meeting depaneling demands in consumer electronics, new energy vehicles, medical electronics, aerospace and other fields.

No physical cutters or molds replacement is required. It can cut any complex contours simply via software programming. Ideal for processing special-shaped boards and high-density boards. It supports rapid model switching for multi-variety and small-batch production, effectively shortening the production cycle.